Thermal Conductive Pad (100x 100mm) Thickness Widely Available(0.5mm - 5.0mm) Silicone Filled in Fine Ceramics Powder Thermal Conductivity 3.5W/mk Soft Flexible Adaptable (0.5mm+1.0mm+2.0mm 3pcs Set)
Free Shipping Included! Thermal Conductive Pad (100x 100mm) Thickness Widely Available(0.5mm - 5.0mm) Silicone Filled in Fine Ceramics Powder Thermal Conductivity 3.5W/mk Soft Flexible Adaptable (0.5mm+1.0mm+2.0mm 3pcs Set) by TAIHEIYO at Pacs BG. MPN: NTA-GR103. Hurry! Limited time offer. Offer valid only while supplies last. Hig Thermal conductive Silicone Filled with Fine Ceramics Powder Technology of Material(fine ceramics filler ) makes the Silicone Flexible and High
Hig Thermal conductive Silicone Filled with Fine Ceramics Powder Technology of Material(fine ceramics filler ) makes the Silicone Flexible and High Thermal conductive Soft and Flexible Material Adapts the Gap of Parts . Easy Recovery of Thickness after Compression of this Material (Reusable) You can Choice the Thickness of Pad from wide range(0.5mm / 1,0mm/2.0mm/3.0mm/4.0mm/5.0mm) ・Color Grey ・Size 100×100ｍｍ（3.93X3.93in) Thickness 0.5ｍｍ（0.0196in) 1.0ｍｍ (0.093in) 2.0mm (0.078in) 3.0ｍｍ (0.118in) 4.0mm (0.157in) 5.0mm (0.196in) •Thermal conductivity 3.5W/mk (ASTM E1461) •耐電圧 6.0kv/mm (ASTMD149) •Hardness ShoreC 18± 3 ・Compressibility 20% ・Flamｍability UL94V-0 (equivalent to) ・Continuous Use Temperature -40～ 180℃ Application :CPU, MICROPROCESSOR、 CHIPSET、 GRAPHICS PROCESSORS、POWER MODULE LED MODULE etc.
NTA-GR103: Features & Highlights
Very Soft and Flexible ,Smoothly Fill the Gap of Parts, Substrate,Heatsink
High Thermal Conductivity 3.5W/mk
Thick Size (Thickness 5.0mm 4.0mm 3.0mm) Available
Trial Set (0.5m 1pcs+ 1.0mm 1pcs + 2.0mm 1pcs) Available for a Developer
Easy Conductive Between heating parts and Housing ,Cabinet etc)
3.94 x 0.16 x 0.16 inches
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